Professor

 

  

Kim, Sung Jin

B.S.

(1982) Seoul National University

M.S.

(1984) Seoul National University

Ph.D.

(1989) Ohio State University

Tel

Tel: 042-350-3043

Fax

Fax: 042-350-3210

e-mail

sungjinkim@kaist.ac.kr

 

Career

 

1990 – 1992: Development Staff Member, IBM (USA)
1992 – 1996: Advisory Engineer, IBM (USA)
1996 – 1997: Senior Engineer, IBM (USA)
1997 – 2003: Associate Professor, KAIST
2003 – present: Professor, KAIST
2002 – present: Associate Editor, International Journal of Transport Phenomena
2005 – present: ASME Fellow
2006 – 2008: Editor, Journal of Mechanical Science and Technology
2007 – 2009: Associate Editor, ASME Journal of Heat Transfer
2011: Chair, KSME Thermal Engineering Division
2012 – present: Director, Center for Flexible and Thin Superconductors
2012 – present: Editor-in-Chief, Transactions of KSME

 

Research interest

 

Cooling Technology for Electronic Packages
Microscale Heat Transfer and Fluid Flow
Optimum Design of Heat Exchanger, Heat Pipes and Heat Sinks
Convection Heat Transfer in Porous Media

 

Papers

 

  • K. Vafai and S. J. Kim, "On the Limitations of the Brinkman-Forchheimer-Extended Darcy Equation," 1995, Int. J. Heat Fluid Flow, Vol. 16, pp. 11-15.
  • A. Bejan, S. J. Kim, Al. Morega and S. W. Lee, " The Cooling of Stacks of Plates Shielded by Porous Screens," 1995, Int. J. Heat Fluid Flow, Vol. 16, pp. 16-24.
  • K. Vafai and S. J. Kim, "Discussion of  Forced Convection in a Porous Channel with Localized Sources," 1995, ASME J. Heat Transfer, Vol. 117, pp. 1097-1098.
  • S. J. Kim and C. Choi., "Convective Heat Transfer Between Porous and Overlying Fluid Layers Heated from below," 1996, Int. J. Heat Mass Transfer, Vol. 39, pp. 3219-3239.
  • C. Choi and S. J. Kim, "Conjugate Mixed Convection in a Channel : Modified Five Percent Deviation Rule," 1996, Int. J. Heat Mass Transfer, Vol. 39, pp. 1223-1234.
  • S. J. Kim, C. Vallarino and A. Claassen, "Review of Fan Life Evaluation Procedures," 1996, Int, J. Reliability, Quality, and Safety Engineering Vol.3, pp. 75-96.
  • S. J. Kim, S. Lee, "On Heat Sink Measurement and Characterization," 1997, ASME J. Advances in Electronic Packaging Vol. 2, pp. 1903-1909.
  • S. J. Kim, D. Kim, "Compact Modeling of Fluid Flow and Heat Transfer in Heat Sinks," 1999, ASME J. Advances in Electronic Packaging, Vol.26-1, pp.719 - 726.
  • S. J. Kim, D. Kim, "Forced Convection in Microstructures for Electronic Equipment Cooling," 1999, ASME J. Heat Transfer, Vol. 121, pp. 639-645.
  • S. J. Kim, D. Kim, and D. Y. Lee, "On the Local Thermal Equilibrium in Microchannel Heat Sinks," 2000, Int. J. Heat Mass Transfer, Vol. 43, pp. 1735-1748.
  • S. J. Kim, D. Kim, "Discussion on Heat Transfer Measurement and Analysis for Sintered Porous Channels," 2000, ASME J. Heat Transfer, Vol. 122, pp. 632-633.
  • S. J. Kim and S. P. Jang, "Experimental and Numerical Analysis of Heat transfer Phenomena in a sensor tube of a Mass Flow Controller," 2001, Int. J. Heat and Mass Transfer, Vol. 44, pp. 1711-1724.
  • S. J. Kim and D. Kim, "Thermal Interaction at the Interface between a Porous Medium and an Impermeable Wall," 2001, ASME J. Heat Transfer, Vol. 123, pp. 527-533.
  • J. S. Go, S. J. Kim, G. Lim, H. Yun, J. Lee, I. Song. and Y.E. Pak, "Heat Transfer Enhancement Using Flow-induced Vibration of a Microfin Array," 2001, Sensors and Actuators. A, Vol. 90, pp.232-239.
  • S. J. Kim, J.H. Ryu and D. H. Choi, "Numerical Optimization of the Thermal Performance of a Microchannel Heat Sink," 2002, Int. J. Heat and Mass Transfer, Vol. 45, pp, 2823-2827.
  • S. J. Kim and S. P. Jang, "Effects of the Darcy Number, the Prandtl Number and the Reynolds Number on the Local Thermal Non-equilibrium," 2002, Int. J. Heat and Mass Transfer, Vol. 45, pp. 3885-3896.
  • S. J. Kim, J. W. Yoo, and S. P. Jang, "Thermal Optimization of a Circular-sectored Finned Tube Using a Porous Medium Approach", 2002, ASME J. Heat Transfer, Vol. 124, pp.1026-1033.
  • S. J. Kim, J. K. Seo, and K. H. Do, "Analytical and Experimental Investigation on the Operation Characteristics and the Thermal Optimization of a Miniature Heat Pipe with a Grooved Wick Structure," 2003, Int. J. Heat and Mass Transfer, Vol.46, pp.2051-2063.
  • S. P. Jang, S. J. Kim and K. W. Paik, "Experimental Investigation of Thermal Characteristics for a Microchannel Heat Sink Subject to an Impinging Jet, Using a Micro-thermal Sensor Array," 2003, Sensors and Actuators A, Vol.105, pp.211-224.
  • S. J. Kim, "Methods for Thermal Optimization of Microchannel Heat Sinks," 2004, Heat Transfer Engineering, Vol.25(1), pp.37-49.
  • J. Y. Min, S. P. Jang, and S. J. Kim, "Effect of Tip Clearance on the Cooling Performance of a Microchannel Heat Sink," 2004, Int. J. Heat and Mass Transfer, Vol. 47, pp.1099-1103.  
  • J. Y. Min, E. F. Hasselbrink and S. J. Kim, "On the Efficiency of Electrokinetic Pumping of Liquids through Nanoscale Channels," 2004, Sensors and Actuators B, Vol. 98, pp.368-377.
  • D. Kim and S. J. Kim, "Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks," 2004, ASME J. Electronic Packaging, Vol 126, pp.247-255.
  • K. H. Kim, S. J. Kim, and J. M. Hyun, " Development of Boundary layers in Transient Buoyant Convection about a Vertical Plate in a Porous Medium ," 2004, Journal of Porous Media, Vol 7, pp. 249~259
  • T. H. Kim and S. J. Kim, "Development of a micro-thermal flow sensor with thin-film thermocouples ," 2006, J. Micromech. Microeng, Vol 16, pp. 2502-2508.
  • J. Y. Min, D. J. Kim and S. J. Kim, "A novel approach to analysis of electroosmotic pumping through rectangular-shaped microchannels ," 2006, Sensors and Actuators B, Vol. , pp. .
  • Kim, D.-K., Han, I.Y. and Kim, S.J., "Study on the steady-state characteristics of the sensor tube of a thermal mass flow meter," 2007, International Journal of Heat Mass Transfer, Vol 50, pp. 1206-1211
  • Kim, D.-K., Majumdar, A., and Kim, S.J., 2007, ¡°Electronic flow meter,¡± Sensors and Actuators A, Vol. 136, pp. 80-89.
  • Lee, W.S, Han, I.Y., Yu, J., Kim, S.J., and Byun, K.Y., 2007, ¡°Thermal Characterization of Thermally Conductive Underfill for a Flip-chip Package Using Novel Temperature Sensing Technique,¡± Thermochimica Acta, Vol. 455, pp. 148-155.
  • Kim, S.J. and Kim, D.-K., 2007, ¡°Sensing and modeling techniques for microscale transport,¡± Int J. Thermal Sciences, Vol. 46, pp. 1142-1152
  • Do, K.H., Min, J.Y. and Kim, S.J., 2007, "Thermal Optimization of an Internally Finned Tube Using Analytical Solutions Based on a Porous Medium Approach," ASME J. of Heat Transfer, Vol. 129, pp. 1408-1416.
  • Kim, D.-K. and Kim, S.J., 2007, ¡°Closed form correlations for thermal optimization of microchannels, ¡± Int. J. Heat Mass Transfer, Vol. 50, pp.  5318-5322.
  • Han, I.Y. and Kim, S.J, 2008, ¡°Diode Temperature Sensor Array for Measuring Micro Scale Surface Temperatures with High Resolution,¡± Sensors and Actuators A, Vol. 141, pp. 52-58.
  • Kim, S.J., Kim, D.-K. and Oh, H.H., 2008, ¡°Comparison of Fluid Flow and Thermal Characteristics of Plate-fin and Pin-fin Heat Sinks Subject to a Parallel Flow,¡± Heat Transfer Engineering, Vol. 29. pp. 169-177.
  • Wang, T.J., Baek, S.W., and Kim, S.J., 2008, ¡°Re-evolution of the Nusselt Number for Determining the Interfacial Heat and Mass Transfer Coefficients in a Flow-through Monolithic Catalytic Converter,¡± Chemical Engineering Science, Vol. 63, pp. 3152-3159.
  • Kim, T.Y., Kim, D.-K., and Kim, S.J., 2008, ¡°Scroll Heat Sink : A Novel Heat Sink with the Moving Fins Inserted between the Cooling Fins,¡± Int. J. Heat Mass Transfer, Vol.  51, pp.  3267-3274.
  • Do, K.H., Kim, S.J., and Garimella, S.V., 2008, ¡°A Mathematical Model for Analyzing the Thermal Characteristics of a Flat Micro Heat Pipe with a Grooved Wick,¡± International Journal of Heat and Mass Transfer, Vol. 51, pp. 4637-4650.
  • Kim, D.-K., Kim, D.J., and Kim, S.J., 2008, ¡°An Electrokinetic Pressure Sensor,¡± Journal of Micromechanics and MicroEngineering, Vol. 18, 055006.
  • Choi, Y.S., Kim, S.J., and Kim, D.J., 2008, ¡°A Semi-empirical Correlation for Pressure Drop in Packed Beds of Spherical Particles,¡± Transport in Porous Media, Vol. 75, pp. 133-149.
  • Choi, Y.S. and Kim, S.J., 2009, ¡°Electrokinetic Flow-induced Currents in Silica Nanofluidic Channels,¡± Journal of Colloid and Interface Science, Vol. 333, pp. 672-678.
  • Kim, T.H., Kim, D.-K., and Kim, S.J., 2009, ¡°Study of the Sensitivity of a Thermal Flow Sensor,¡± Int. J. Heat Mass Transfer, Vol. 52, pp. 2140-2144.
  • Choo, K.S., Yoon, Y.J., Kim, S.J., and Lee, D.H., 2009, ¡°Heat Transfer Characteristics of a Micro-scale Impinging Slot Jet,¡± Int. J. Heat Mass Transfer, Vol. 52, pp. 3169-3175.
  • Kim, D.-K., Kim, S.J., and Bae, J.-K.,  2009, ¡°Comparison of Thermal Performances of Plate-fin And Pin-fin Heat Sinks Subject to an Impinging Flow,¡± Int. J. Heat Mass Transfer, Vol. 52, pp. 3510-3517.
  • Kim, T.Y. and Kim, S.J., 2009, ¡°Fluid Flow and Heat Transfer Characteristics of Cross-cut Heat Sinks,¡± Int. J. Heat Mass Transfer, (In press).
  • Kim, T.Y., Kim, D.-K., and Kim, S.J., 2009, ¡°Scanning Flow-impedance Microscopy: An Imaging Technique Based on Hydrodynamics,¡± Rev. Sci. Instrum., (In press).
  • Choo, K.S. and Kim, S.J., 2009, ¡°Heat Transfer Characteristics of Impinging Air Jets under a Fixed Pumping Power Condition,¡± Int. J. Heat Mass Transfer, (In press).
  • K.S.Choo, S.J.Kim, Heat transfer characteristics of impinging air jets under a fixed pumping power condition, International Journal of Heat and Mass Transfer 53 (2010) 320–326.
  • K.H.Do, T.H.Kim, and S.J. Kim, Analytical and experimental investigations on fluid flow and thermal characteristics of a plate-fin heat sink subject to a uniformly impinging jet,International Journal of Heat and Mass Transfer 53 (2010) 2318 - 2323.  
  • C.Byon, Y.Nam, S.J. Kim, and Y.S.Ju, Drag reduction in Stokes flows over spheres with nanostructured superhydrophilic surfaces,  Journal of Applied Physics 107,(2010) 066102.
  • D.K.Kim, D.J.Kim, S.J.Kim, and S.J. Park. Effect of ionic mobility of working electrolyte on electrokinetic energy conversion in sub-micron channels. International Journal of Thermal Sciences 49.(2010) 1128-1132.
  • K.S.Choo, S.J.Kim, Comparison of thermal characteristics of confined and unconfined impinging jets, International Journal of Heat and Mass Transfer 53 (2010) 3366–3371.
  • Y.Nam, S.Sharratt, C.Byon, S.J.Kim, and Y.S.Ju, Fabrication and Characterization of the Capillary Performance of Superhydrophilic Cu Micropost Arrays, Journal of Microelectromechanical Systems 19 (2010) 581-588.
  • D. K. Kim, J. Jung, S.J. Kim, Thermal optimization of plate-fin heat sinks with variable fin thickness, International Journal of Heat and Mass Transfer 53 (2010) 5988-5995.
  • K.Choo, S.J.Kim, Heat transfer and fluid flow characteristics of two-phase impinging jets, International Journal of Heat and Mass Transfer  53 (2010) 5692-5699.
  • Y.J. Youn, K.Choo, S.J. Kim, Effect of confinement on heat transfer characteristics of a microscale impinging jet, International Journal of Heat and Mass Transfer 54 (2011) 366-373.
  • Y.J. Baik, M. Kim, K.C. Chang, S.J. Kim, Power-based performance comparison between carbon dioxide and R125 transcritical cycles for a low-grade heat source, Applied Energy 88 (2011) 892-898.
  • C. Byon, K. Choo, and S.J. Kim, Experimental and analytical study on chip hot spot temperature, International Journal of Heat and Mass Transfer 54 (2011) 2066–2072.
  • T.H. Kim, S.J. Kim, Development of a helium flow sensor based on dieletric barrier discharge at atmospheric pressure, Sensors and Actuators A 167 (2011) 297-303.  
  • K. Choo, S.J. Kim, Heat Transfer and Fluid Flow Characteristics of Nonboiling Two-Phase Flow in Microchannels, ASME Journal of Heat Transfer 133 (2011) 102901.  
  • C. Byon and S.J. Kim, The Effect of Meniscus on the Permeability of Micro-post Arrays, Journal of Micromechanics and Microengineering 21(2011) 115011.
  • Y. J. Youn and S.J. Kim, Fabrication and evaluation of a silicon-based micro pulsating heat spreader, Sensors & Actuators: A. Physical 174 (2012) 189-197.
  • K.-L. Suk, K. Choo, S.J. Kim, J.-S. Kim, and K.-W. Paik, Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs), Microelectronics Reliability 52 (2012)  1182-1188.
  • K. Choo, T. Y. Kang, and S.J. Kim, The effect of inclination on impinging jets at small nozzle-to-plate spacing, International Journal of Heat and Mass Transfer 55 (2012) 3327-3334.
  • C. Byon and S.J. Kim, Capillary Performance of Bi-porous Sintered Metal Wicks, International Journal of Heat and Mass Transfer 55 (2012) 4096-4103.
  • C. Byon and S.J. Kim, Effects of geometrical parameters on the boiling limit of bi-porous wicks, International Journal of Heat and Mass Transfer 55 (2012) 7884–7891.
  • J. Kim and S.J. Kim, Heat transfer characteristics of a centrifugal heat sink, International Journal of Heat and Mass Transfer 56 (2013) 188–196.
  • J. Kim, S.J. Kim, D.K. Kim, Energy harvesting from salinity gradient by reverse electrodialysis with anodic alumina nanopores, Energy 51 (2013) 413-421.
  • G.H. Kwon, T.Y. Kim, S.J. Kim, Electrokinetic microscopy: A technique for imaging three-dimensional surface topography and heterogeneity of surface material, Review of Scientific Instruments 84 (2013) 043706.
  • C. Byon, S.J. Kim, The effect of the particle size distribution and packing structure on the permeability of sintered porous wicks, International Journal of Heat and Mass Transfer 61 (2013) 499-504.
  • D.G. Trainer, J. Kim, and S.J. Kim, Heat transfer and flow characteristics of air-assisted impinging water jets, International Journal of Heat and Mass Transfer 64 (2013) 501-513.
  • C. Byon, S. Choi, S.J. Kim, Critical heat flux of bi-porous sintered copper coatings in FC-72, International Journal of Heat and Mass Transfer 65 (2013) 655-661.
  • C. Byon, S.J. Kim, Study on the capillary performance of micro-post wicks with non-homogeneous configurations, International Journal of Heat and Mass Transfer 68 (2014) 415-421.
  • J. Jung, S.J. Kim, J. Kim, Observations of the Critical Heat Flux Process During Pool Boiling of FC-72, Journal of Heat Transfer 136 (2014) 041501.
  • S.H. Moon, G. Hwang, S.J. Kim, J.K. Seo, Thermal Analysis and Testing of a Heat Pipe With Woven Wired Wick, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, No. 6, (2014) 991-998.
  • G.H. Kwon, S.J. Kim, Operational characteristics of pulsating heat pipes with a dual-diameter tube, International Journal of Heat and Mass Transfer 75 (2014) 184-195.
  • Y. Joo, S.J. Kim, Comparison of thermal performance between plate-fin and pin-fin heat sinks in natural convection, International Journal of Heat and Mass Transfer 83 (2015) 345-356.
  • G.H. Kwon, S.J. Kim, Experimental investigation on the thermal performance of a micro pulsating heat pipe with a dual-diameter channel, International Journal of Heat and Mass Transfer 89 (2015) 817-828.
  • Y. Joo, S.J. Kim, Thermal optimization of vertically oriented, internally finned tubes in natural convection, International Journal of Heat and Mass Transfer 93 (2016) 991-999.
  • K. Choo, S.J. Kim, The influence of nozzle diameter on the circular hydraulic jump of liquid jet impingement , Experimental Thermal and Fluid Science 72 (2016) 12-17.
  • S. Jun, S.J. Kim, Comparison of the thermal performances and flow characteristics between closed-loop and closed-end micro pulsating heat pipes, International Journal of Heat and Mass Transfer 95 (2016) 890-901.
  • T.H. Kim, K.H. Do, and S.J. Kim, Closed-form correlations of pressure drop and thermal resistance for a plate fin heat sink with uniform air jet impingement, Energy Conversion and Management 136 (2017) 340-349.
  • J. Lee, S.J. Kim, Effect of channel geometry on the operating limit of micro pulsating heat pipes, International Journal of Heat and Mass Transfer 107 (2017) 204-212.
  • Y. Joo, I. Lee, S.J. Kim, Topology optimization of heat sinks in natural convection considering the effect of shape-dependent heat transfer coefficient, International Journal of Heat and Mass Transfer 109 (2017) 123-133.
  • A. Yoon, S.J. Kim, Characteristics of oscillating flow in a micro pulsating heat pipe: fundamental-mode oscillation, International Journal of Heat and Mass Transfer 109 (2017) 242-253.
  • J. Jo, S.J. Kim, Conjugate heat transfer by oscillating flow in a parallel-plate channel subject to a sinusoidal wall temperature distribution, Applied Thermal Engineering 123 (2017) 1462-1472.
  • S. Choi, S.J. Kim, Effect of initial cooling on heat and mass transfer at the cryogenic surface under natural convective condition, International Journal of Heat and Mass Transfer 112 (2017) 850-861.
  • J. Bae, S.Y. Lee, and S.J. Kim, Numerical investigation of effect of film dynamics on fluid motion and thermal performance in pulsating heat pipes, Energy Conversion and Management 151 (2017) 296-310.
  • J. Jung, J. Kim, H. Lee, and S.J. Kim, Measurement of phase distributions on the surface in subcooled pool boiling of FC-72, International Journal of Heat and Mass Transfer 115 (2017) 62-72.
  • D. Yu, W. Jeon, and S.J. Kim, Analytic solutions of the friction factor and the Nusselt number for the low-Reynolds number flow between two wavy plate fins, International Journal of Heat and Mass Transfer 115 (2017) 307-316.
  • H.Y. Noh, S.J. Kim, Thermal characterization and optimization of pulsating heat pipes operating in a circulation mode, International Journal of Heat and Mass Transfer 115 (2017) 1234-1246.
  • J. Lim, S.J. Kim, Fabrication and experimental evaluation of a polymer-based flexible pulsating heat pipe, Energy Conversion and Management 156 (2018) 358-364.
  • H. Kwon, Y. Joo and S.J. Kim, Analytic approach to thermal optimization of horizontally oriented radial plate-fin heat sinks in natural convection, Energy Conversion and Management 156 (2018) 555-567.
  • S.I. Kim, S.J. Kim, Analysis of the electroviscous effects on pressure-driven flow in nanochannels using effective ionic concentrations, Microfluidics and Nanofluidics 22 (2018) 1-12.
  • J. Kim, S.J. Kim, Experimental investigation on the effect of the condenser length on the thermal performance of a micro pulsating heat pipe, Applied Thermal Engineering 130 (2018) 439-448.
  • W. Kim, S.J. Kim, Effect of reentrant cavities on the thermal performance of a pulsating heat pipe, Applied Thermal Engineering 133 (2018) 61-69.
  • G. Lee, S.J. Kim, Thermal optimization of radial plate fin heat sinks under an L-shaped flow, Applied Thermal Engineering 133 (2018) 580-587.
  • J. Lee, Y. Joo, and S.J. Kim, Effects of the number of turns and the inclination angle on the operating limit of micro pulsating heat pipes, International Journal of Heat and Mass Transfer 124 (2018) 1172-1180.

Patents

    • Surface analysis and measurement method based on flow resistance of fluid and atomic force microscope using   the method, U. S. Patent Number 8,316,693, U. S. Patent and Trademark Office, November 27, 2012.
    • Heat spreader with flat plate and manufacturing method thereof, Korea Patent Number 10-1205715, Korean   Intellectual Property Office, November 22, 2012.
    • Wick for heat pipes using metal particle and preparing thereof, Korea Patent Number 10-1177062, Korean   Intellectual Property Office, August 20, 2012.
    • Installation fins and Installation structure of fins and a Heat sink with moving fins inserted between cooling  fins,    U. S. Patent Number 8201616, U. S. Patent and Trademark Office, June 19, 2012.
    • Installation fins and Installation structure of fins and a Heat sink with moving fins inserted between cooling  fins,   Chinese Patent Number ZL 200780000691.3, The State Intellectual Property Office of the People¡¯s  Republic of   China, April 25, 2012.
    • Installation fins and Installation structure of fins and a Heat sink with moving fins inserted between cooling fins,   Taiwanese Patent Number 2011111400263720, Nan E Int. Patent and Trademark Office, November 28, 2011.
    • Heat Sink, Korea Patent Number 10-1000020, Korean Intellectual Property Office, December 03, 2010.
    • A atom-microscope using analysis measurement based on flowing resistance of fluid, Korea Patent Number 10-    0956165, Korean Intellectual Property Office, April 27, 2010.
    • Heat Sink, Korea Patent Number 10-0945052, Korean Intellectual Property Office, February 23, 2010.
    • Electrokinetic Microscope, Korea Patent Number 10-0935902, Korean Intellectual Property Office, December 30, 2009.
    • The Mechanical Energy Generator which Uses Fluid Pressure in Flexible Tube, Korea Patent Number 10-    0853549, Korean Intellectual Property Office, August 14, 2008.
    • Installation Fins and Installation Structure of Fins and a Heat Sink with Moving Fins Inserted between Cooling     Fins, Korea Patent Number 10-0743268, Korean Intellectual Property Office, July 20, 2007,     PCT/KR2007/003761, PCT, August 4, 2007.
    • A Thin Film Type Micro-Thermal Sensor, and a Method Offabricating the Same, Korea Patent Number 10-    0444633, Korean Intellectual Property Office, August 6, 2004.
    • A Clinical Thermometer, Korea Patent Number 10-0379776, Korean Intellectual Property Office, March 29, 2003.
    • Fan Venturi Block Detection, U.S. Patent Number 6,023,138, U.S. Patent and Trademark Office, February 8, 2000.
    • Method and Apparatus for Immersion Cooling of an Electronic Board, U.S. Patent Number 5,305,184, U.S. Patent    and Trademark Office, April 19, 1994.
    • Integrated Heat Pipe and Circuit Board Structure, U.S. Patent Number 5,283,715, U.S. Patent and Trademark    Office, February 1, 1994.
    • Heat Transfer Device for Use with a Heat Sink in Removing Thermal Energy from an Integrated Circuit Chip, U.S.   Patent Number 5,270,902, U.S. Patent and Trademark Office, December 14, 1993.     

 

 

 

 

Capyrigt(C) Applied Heat Transfer Lab. Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology

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